Inspection of Semiconductor Packages
Load frame manufacture | |
die pad down set | |
Die attach | |
die placement accuracy | |
defect analysis, such as crack and tilt die | |
surface contamination | |
Wire bonding | |
bond placement accuracy | |
bond size measurement | |
wire loop height | |
Ball Grid Array (BGA) devices | |
ball placement accuracy | |
ball size measurement | |
and many others ..... |
Inspection of Semiconductor Package